Engis Corporation Engis Corporation Engis Corporation
  • Engis Corporation
  • Home
  • Company
  • Products
  • Information
  • Contact Us
  • Engis
  • HYPREZ Consumables

Hyprez Wafer Thinning Device (WTD)


Contact Engis
Download WTD Brochure
Lapping Machines & Accessories
Hyprez Slurry and Lubes
Hyprez Lapping Plates
Process Development Assistance
Designed to accurately control thickness and parallelism of thin and delicate parts during lapping and polishing operations, the Hyprez WTD is capable of accepting a variety of product configurations. In addition, it can be used in conjunction with a parts carrier to process multiple parts in a single cycle resulting in decreased manufacturing costs.

Key Features
•  A vacuum chuck with a hardened steel support ring and digital indicator to monitor part thickness.
•  A powerful vacuum system featuring a dial gauge to monitor pressure along with a quick-connect for fast changeovers, maximizing ease of operation.
•  In addition, the free weight platform can be used as a device stand.

Robust and durable, the WTD is portable and easy to use. Upon request, Engis can provide wear resistant contact surfaces or customized sub-fixtures to accommodate your specific parts handling requirements.

Read more on Part Size Control & Parallelism

Engis Corporation Engis Corporation
Engis Corporation Engis Corporation Engis Corporation
Engis Corporation
Engis Corporation Engis Corporation Engis Corporation
Engis Corporation Engis Corporation

Engis Corporation Engis Corporation
Engis Corporation Engis Corporation Engis Corporation Engis Corporation
The WTD is available in sizes to handle 3”, 4” and 6” wafers and is sized to pair with industry standard lapping equipment. Engis Corporation
Engis Corporation Engis Corporation
Engis Corporation Engis Corporation

MODEL WTD-75V WTD-100V WTD-150V
Vacuum
Fixture
Wafer Size: 75mm (3”) 100mm (4”) 150mm (6”)
Sub Jig Diameter
Max Part Clearance:
120mm (4.72”) 120mm (4.72”) 172mm (6.75”)
Gauge resolution: 1µm (.00004”) 1µm (.00004”) 1µm (.00004”)
Force Control: Spring Tension & Die Weight Spring Tension & Die Weight Spring Tension & Die Weight
Maximum Force 3.7kg (8.15lb) 3.7kg (8.15lb) 4.7kg (10.37lb)
Dimensions: Ø170mm x
244 mmH
(6.7 x 9.61”)
Ø170mm x
244 mmH
(6.7 x 9.61”)
Ø170mm x
244 mmH
(6.7 x 9.61”)
Weight: 7.3kg (16.1lb) 7.3kg (16.1lb) 9.9kg (21.8lb)
Vacuum
Pump
Volts:
(Can be ordered in either 110 or 220)
110 or 220
Single Phase
60 Hz
110 or 220
Single Phase
60 Hz
110 or 220
Single Phase
60 Hz
Watts: 150 150 150
Vacuum Meter: -760 mm Hg
R 1/4
-760 mm Hg
R 1/4
-760 mm Hg
R 1/4
Weight: 7.5 kg (16.5lb) 7.5 kg (16.5lb) 7.5 kg (16.5lb)

Give us the opportunity to provide you with the best Process Development, Sales and Customer Support in the industry.
Contact your local Engis
Regional Sales Manager or Customer Service Representative.


Engis Corporation © 2012 Engis CorporationEngis CorporationPrivacy Statement    •    Terms of Use    •    Site MapEngis CorporationISO 9001:2008 Registered Engis Corporation
Engis Corporation
Home  •  Company  •  Lapping & Polishing  •  Diamond Powder  •  Grinding Products  •  Bore Finishing  •  Mold & Die Products  •  Information  •  Contact Us