Our Engis® Hyprez® EAG Model multi-spindle grinding system provides a cost-effective, high-precision wafering solution. This fully automated system grinds both sides of silicon carbide wafers using non-contact, in-situ measurement techniques to achieve targeted thickness control and ultra-flatness, often reducing or eliminating the need for lapping.

Through a fully automatic cassette-to-cassette operation, the system aims to streamline wafer production and enable the development of tailored "Grind-to-CMP processes" for wafers produced by any slicing method.