--- title: EAG-28DANX Series Grinding Machines description: Semiconductor wafer grinding image: https://www.engis.com/hubfs/Small%20copy.png --- [![Engis](https://www.engis.com/hs-fs/hubfs/Web%20Header.png?width=357&height=100&name=Web%20Header.png "Engis")](https://www.engis.com/homepage) ** [News](https://www.engis.com/press-and-news) [Articles](https://www.engis.com/knowledge-center)  [Careers](https://www.engis.com/careers) [Locations](https://www.engis.com/locations)   # EAG Dual Spindle, Fully-Automated Grinding System [![Inquiries, Sales or Support ](https://no-cache.hubspot.com/cta/default/4228839/5626bc65-bd03-42c9-b559-8f57e72ed9a3.png)](https://cta-redirect.hubspot.com/cta/redirect/4228839/5626bc65-bd03-42c9-b559-8f57e72ed9a3) --- ![Diamond Struture](https://www.engis.com/hs-fs/hubfs/Diamond%20Struture.jpg?width=183&height=128&name=Diamond%20Struture.jpg)[**SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE**](https://www.engis.com/engis-micron-diamond-and-cbn-powders)[--- ](https://www.engis.com/engis-micron-and-cbn-diamond-powders) ![Man with microscope](https://www.engis.com/hs-fs/hubfs/cta1.jpg?width=155&height=133&name=cta1.jpg)[******ADVANCED PROCESS DEVELOPMENT****** --- ](https://www.engis.com/p)![WEBBTELESCOPE 2](https://www.engis.com/hs-fs/hubfs/WEBBTELESCOPE%202.png?width=163&height=137&name=WEBBTELESCOPE%202.png)**[VISIT OUR KNOLWEDGE CENTER](https://www.engis.com/knowledge-center)** --- ![Tradeshow Schedule (1)](https://www.engis.com/hs-fs/hubfs/Tradeshow%20Schedule%20(1).png?width=147&height=118&name=Tradeshow%20Schedule%20(1).png) [**LEARN MORE** --- ](https://www.engis.com/events)   Our Engis® Hyprez® EAG Model multi-spindle grinding system provides a cost-effective, high-precision wafering solution. This fully automated system grinds both sides of silicon carbide wafers using non-contact, in-situ measurement techniques to achieve targeted thickness control and ultra-flatness, often reducing or eliminating the need for lapping. Through a fully automatic cassette-to-cassette operation, the system aims to streamline wafer production and enable the development of tailored "Grind-to-CMP processes" for wafers produced by any slicing method.    ![3040_1](https://4228839.fs1.hubspotusercontent-na1.net/hub/4228839/hubfs/3040_1.png?width=1200&length=1200&name=3040_1.png) ![3040_2](https://4228839.fs1.hubspotusercontent-na1.net/hub/4228839/hubfs/3040_2.png?width=1200&length=1200&name=3040_2.png) ![3040_4](https://4228839.fs1.hubspotusercontent-na1.net/hub/4228839/hubfs/3040_4.png?width=1200&length=1200&name=3040_4.png) ![3040_6](https://4228839.fs1.hubspotusercontent-na1.net/hub/4228839/hubfs/3040_6.png?width=1200&length=1200&name=3040_6.png) ![3040_9](https://4228839.fs1.hubspotusercontent-na1.net/hub/4228839/hubfs/3040_9.png?width=1200&length=1200&name=3040_9.png) --- **•  Fully automatic dual spindle grinder  •** **•  Rough and fine grinding with two spindles  •** **•  In-process non contact thickness measurement or contact gauge  •** **•  Stiff cast frame structure  •** **•  PC-based machine  •** **• SECS/GEM interface protocol  •** **•  Real-time data monitoring  •** --- ## **EAG MODEL OVERVIEW** **![EAG Dual](https://www.engis.com/hs-fs/hubfs/EAG%20Dual.jpg?width=925&height=506&name=EAG%20Dual.jpg)**   # ![](https://www.engis.com/hs-fs/hubfs/image-png-Aug-14-2024-08-51-20-5520-PM.png?width=635&height=385&name=image-png-Aug-14-2024-08-51-20-5520-PM.png) PROCESS OVERVIEW ![ProcessOverviewAllV5 copy-1](https://www.engis.com/hs-fs/hubfs/ProcessOverviewAllV5%20copy-1.png?width=2560&height=2100&name=ProcessOverviewAllV5%20copy-1.png) AUTOMATION  OVERVIEW --- --- ![ProcessAutomationV3-1](https://www.engis.com/hs-fs/hubfs/ProcessAutomationV3-1.png?width=2000&height=1739&name=ProcessAutomationV3-1.png "ProcessAutomationV3-1") ## **OPERATION SCREEN** --- ![OperationScreen3045 copy](https://www.engis.com/hs-fs/hubfs/OperationScreen3045%20copy.png?width=2000&height=770&name=OperationScreen3045%20copy.png "OperationScreen3045 copy") [![Contact Us-2](https://www.engis.com/hs-fs/hubfs/Contact%20Us-2.jpg?width=222&height=46&name=Contact%20Us-2.jpg)](https://www.engis.com/contact)       --- [About Engis](https://www.engis.com/about-engis) [News & Press](https://www.engis.com/press-and-news) [Careers](https://www.engis.com/careers) [Locations](https://www.engis.com/locations) [Catalogs & Media](https://www.engis.com/catalogs-media) [Events](https://www.engis.com/events) [Contact Us](https://www.engis.com/contact) ![ISO 9001 Certified Quality Management System - White](https://www.engis.com/hs-fs/hubfs/ISO%209001%20Certified%20Quality%20Management%20System%20-%20White.png?width=109&height=43&name=ISO%209001%20Certified%20Quality%20Management%20System%20-%20White.png) 105 West Hintz Road, Wheeling, IL 60090 [Call: 847-808-9400](tel:+1-847-808-9400) Fax: +1-847-808-9430 ©2026 Engis Corporation. All Rights Reserved. Engis® is a registered trademark of Engis Corporation, USA and other countries. All products denoted with ® or ™ are registered trademarks or trademarks of Engis Corporation. [Privacy Statement](https://www.engis.com/privacy-statement) | [Terms of Use](https://www.engis.com/terms-of-use) | [Site Map](https://www.engis.com/site-map) | [Engis Terms & Conditions](https://www.engis.com/terms) [**](https://www.engis.com/dual_spindle_grinding_machine-danx#) ```json { "@context" : "https://schema.org", "@type" : "VideoObject", "contentUrl" : "https://4228839.fs1.hubspotusercontent-na1.net/hubfs/4228839/EAG-28DANX.mp4", "dateModified" : "2023-06-27T16:59:29.503Z", "duration" : "PT2M35S", "height" : 1080, "name" : "EAG-28DANX", "thumbnailUrl" : "https://4228839.fs1.hubspotusercontent-na1.net/hubfs/4228839/EAG-28DANX.mp4/medium.jpg?t=1687885169503", "uploadDate" : "2023-06-27T16:57:20.600Z", "width" : 1920 } ```