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      • About Engis
        • About Us
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      • Products
        • Superabrasive Powders
          • Engis® Diamond and CBN Powders - Grinding, Lapping & Polishing Applications
          • Precision Micron Diamond Powder
          • Nanometer Size Diamond Powder
          • Engis® Feedstock for PCD & PCBN Sintering
          • Engis® Micron Diamond and CBN Powders
            • Particle Size Distribution (PSD)
            • Surface Cleanliness
            • Extrinsic & Intrinsic Impurities
            • Dynamic Particle Shape Analysis
            • Product Quality and Consistency
            • Engis® Micron and CBN Diamond Powders
            • Consistent Application Performance
            • Mechanical Properties
        • Lapping & Polishing
          • Hyprez® Lapping & Polishing
          • Facing & Grooving
          • Fastlap Machines
          • EVG Grinder Series
          • Hyprez® Slurries
          • Hyprez® Lapping Plates
          • Hyprez® Diamond Compound
          • Lapping & Polishing Industries
        • Superabrasive Tools
          • Electroplated Superabrasive Grinding Wheels
          • Foundry Products
          • Electromill® Diamond Milling
          • Diamond CBN Saw Blades
          • Diamond CBN Pins & Mandrels
          • Electroplated Dressing Blocks
          • Replate Service and Technical Support
        • Bore Honing Systems
          • Bore Finishing Process
          • Dual Bore Diamond Tools
          • Single-Pass & Multi-stroke Bore Finishing
          • Bore Finishing Machines
          • Automation and Gauging Packages
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        • About Engis
          • About Us
          • Associations & Affiliations
          • Core Values
          • Engis History
          • Quality Statement & ISO Certification
          • President's Message
          • Systems Approach
          • Engis Terms and Conditions
        • Products
          • Superabrasive Powders
            • Engis® Diamond and CBN Powders - Grinding, Lapping & Polishing Applications
            • Precision Micron Diamond Powder
            • Nanometer Size Diamond Powder
            • Engis® Feedstock for PCD & PCBN Sintering
            • Engis® Micron Diamond and CBN Powders
              • Particle Size Distribution (PSD)
              • Surface Cleanliness
              • Extrinsic & Intrinsic Impurities
              • Dynamic Particle Shape Analysis
              • Product Quality and Consistency
              • Engis® Micron and CBN Diamond Powders
              • Consistent Application Performance
              • Mechanical Properties
          • Lapping & Polishing
            • Hyprez® Lapping & Polishing
            • Facing & Grooving
            • Fastlap Machines
            • EVG Grinder Series
            • Hyprez® Slurries
            • Hyprez® Lapping Plates
            • Hyprez® Diamond Compound
            • Lapping & Polishing Industries
          • Superabrasive Tools
            • Electroplated Superabrasive Grinding Wheels
            • Foundry Products
            • Electromill® Diamond Milling
            • Diamond CBN Saw Blades
            • Diamond CBN Pins & Mandrels
            • Electroplated Dressing Blocks
            • Replate Service and Technical Support
          • Bore Honing Systems
            • Bore Finishing Process
            • Dual Bore Diamond Tools
            • Single-Pass & Multi-stroke Bore Finishing
            • Bore Finishing Machines
            • Automation and Gauging Packages
            • Multi-Stroke Honing Systems
            • Contract Honing Services
          • Mold & Die Polishing
            • Polishing Compounds
            • Diprofil Finishing Systems
            • Minimo Finishing Systems
            • Polishing Accessories
            • SST Microwelding Systems
        • Industries
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          • Catalogs and Brochures
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