Precision Optical/Photonic Lens Lapping/Polishing

Lapping Sapphire, Zinc Selenide, Zinc Sulfide, Germanium, Calcium Fluoride, Magnesium Fluoride, Silicon Carbide, Beryllium, YAG and Gallium Nitride

While fused Silica, BK7 and Borofloat are relatively easy to lap and polish using cerium oxide and other conventional abrasives, super-hard materials like sapphire or zinc selenide present an entirely new challenge. Lapping cycles can become very long which drive up costs and lower factory output.

Our R&D Labs specialize in developing new products for the processing of optical and photonic substrates while our Process Development Laboratories work hand-in-hand with customers to reduce cycle times, improve part quality and finishes while at the same time reducing waste and rejects. Also, we offer full systems solutions to any application challenge; the machines, machine accessories and consumables.

We are experienced with many exotic materials such as Sapphire, Zinc Selenide, Zinc Sulfide, Germanium, Calcium Flouride, Magnesium Fluoride, Silicon Carbide, Beryllium, YAG and Gallium Nitride. All of these materials lend themselves to being processed more efficiently with diamond than Boron Carbide or Cerium. Let our specialized labs work with you to: Improve flatness, parallelism and surface finish Reduce cycle times and improve productivity Reduce waste and associated disposal issues Lower overall costs
HVG Series Precision Grinding Machines
HVG Series Precision Grinding Machines and grinding wheels offer a first step process to remove damage from slicing, improve flatness, and to reach your desired thickness while improving surface quality. The HVG Series offers a compact design, robust build, and advanced PLC controls and monitoring functions. OPTIONS • Max. substrate size: up to 300 mm • Wheel dressings: manual or auto • Substrate thickness measurement & control • Wheel load monitoring control
FastLap Machines
The durable design of the FastLap Lapping & Polishing machines offers versatility for challenging applications like sapphire. These machines are configured for either lapping or polishing, using pneumatic pressure control for high throughput. Suited for use with HYPREZ composite plates, polishing pads, diamond, and nondiamond slurries. OPTIONS • Max. substrate size up to 430 mm • Configuration for either lapping or polishing • Lap Plate Flatness control Facing or plated conditioning ring • Lap plate temperature control • Advanced control features: substrate thickness, temperature, and torque.
Precision Lap Plates
COMPOSITE LAP PLATES HYPREZ composite plates are an economical alternative to solid metal plates for efficient sapphire lapping, especially when utilizing Engis facing technology.
C250 Lap Plate This composite copper lap plate provides high stock removal and is suited for diamond sizes from 3-15 microns for first step lapping	TX-10A Lap Plate This tin composite plate is ideal for second step of lapping to achieve an optical quality finish or to minimize subsequent pad polishing times.
Advanced Consumables for Sapphire
DIAMOND LAPPING SLURRY Our precision graded slurries are available in either water soluble or oil based suspensions. For sapphire, polycrystalline diamond will provide maximum efficiency and excellent surface finishes.
POLYCRYSTALLINE DIAMOND COMPOUND HYPREZ L Compound using polycrystalline diamond helps achieve high surface quality on sapphire domes and other 3D shapes. Diamond sizes from 50 nm - 30 microns available.
POLISHING SLURRY & PADS Hyprez polishing slurries & pads are customized to the type of sapphire being polished and are available in a variety of configurations to suit your needs.

Lapping and Polishing of Precision Optics and Photonic Lenses

Lapping Sapphire, Zinc Selenide, Zinc Sulfide, Germanium, Calcium Fluoride, Magnesium Fluoride, Silicon Carbide, Beryllium, YAG and Gallium Nitride