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      • Products

      Superabrasive Powders

      • Engis® Diamond and CBN Powders - Grinding, Lapping & Polishing Applications
      • Precision Micron Diamond Powder
      • Engis® Feedstock for PCD & PCBN Sintering
      • Engis® Micron Diamond and CBN Powders
        • Particle Size Distribution (PSD)
        • Surface Cleanliness
        • Extrinsic & Intrinsic Impurities
        • Dynamic Particle Shape Analysis
        • Product Quality and Consistency
        • Engis® Micron and CBN Diamond Powders
        • Consistent Application Performance
        • Mechanical Properties

      Lapping & Polishing

      • Hyprez® Lapping & Polishing
      • Fastlap Machines
      • Hyprez® Slurries
      • Hyprez® Lapping Plates
      • Hyprez® Diamond Compound

      Superabrasive Tools

      • Electroplated Superabrasive Grinding Wheels
      • Foundry Products
      • Electromill® Diamond Milling
      • Diamond CBN Saw Blades
      • Diamond CBN Pins & Mandrels
      • Electroplated Dressing Blocks
      • Replate Service and Technical Support

      Bore Honing Systems

      • Bore Finishing Process
      • Single-Pass & Multi-stroke Bore Finishing
      • Bore Finishing Machines
      • Automation and Gauging Packages

      Mold & Die Polishing

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      Advanced Process Development

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      • About Engis
        • About Us
        • Associations & Affiliations
        • Core Values
        • Engis History
        • Quality Statement & ISO Certification
        • President's Message
        • Systems Approach
        • Engis Terms and Conditions
      • Products
        • Superabrasive Powders
          • Engis® Diamond and CBN Powders - Grinding, Lapping & Polishing Applications
          • Precision Micron Diamond Powder
          • Nanometer Size Diamond Powder
          • Engis® Feedstock for PCD & PCBN Sintering
          • Engis® Micron Diamond and CBN Powders
            • Particle Size Distribution (PSD)
            • Surface Cleanliness
            • Extrinsic & Intrinsic Impurities
            • Dynamic Particle Shape Analysis
            • Product Quality and Consistency
            • Engis® Micron and CBN Diamond Powders
            • Consistent Application Performance
            • Mechanical Properties
        • Lapping & Polishing
          • Hyprez® Lapping & Polishing
          • Facing & Grooving
          • Fastlap Machines
          • Hyprez® Slurries
          • Hyprez® Lapping Plates
          • Hyprez® Diamond Compound
          • Lapping & Polishing Industries
          • Hyprez Polishing Pads
          • Helical ID & OD Lapping Tools
        • Wafering Solutions
          • EAG-28SAND
          • EAG-28DANX
          • HVG Grinder Series
        • Superabrasive Tools
          • Electroplated Superabrasive Grinding Wheels
          • Foundry Products
          • Electromill® Diamond Milling
          • Diamond CBN Saw Blades
          • Diamond CBN Pins & Mandrels
          • Electroplated Dressing Blocks
          • Replate Service and Technical Support
        • Bore Honing Systems
          • Bore Finishing Process
          • Dual Bore Diamond Tools
          • Single-Pass & Multi-stroke Bore Finishing
          • Bore Finishing Machines
          • Automation and Gauging Packages
          • Multi-Stroke Honing Systems
          • Contract Honing Services
          • Helical Laps
        • Mold & Die Polishing
          • Polishing Compounds
          • Diprofil Finishing Systems
          • Minimo Finishing Systems
          • Polishing Accessories
          • SST Microwelding Systems
      • Industries
      • Catalogs & Media
        • Catalogs and Brochures
        • Videos
        • Press Releases
      • Events
      • Contact Us
        • Customer Service & Technical Support
        • Safety Data Sheets
        • Locations
      • Knowledge Center
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