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    Hyprez® Polishing Pads

     

    • Hyprez® Diamond & Colloidal Slurries and Dispensing Units
    • Hyprez® Diamond Compound
    • Fastlap Machines
    • Hyprez® Lapping Plates
    • Hyprez® Lap Plate Facing & Grooving
    • Hyprez® Polishing Pads
    • Helical Laps
    • Products
    • Lapping & Polishing
    • Hyprez® Polishing Pads

    Diamond Struture
    SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE

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    Engis offers a full selection of polishing pads and cloths to meet demanding polishing and planarization requirements for industrial as well as advanced materials.  In addition to industry standard pads, Engis can engineer special pads to meet your needs.

    Qualification criteria make our cloths the best available in the industry.  Using an array of test materials and slurries, extensive evaluations are performed to ensue these pads meet Engis exacting standards for optimum performance.

    Polishing Pads (3)

    The production of an exacting surface finish on silicon or other semiconductor crystals has become more demanding and it has become highly critical to meet the requirements of today's semiconductor industry.  At Hyprez we strive to meet the ever-changing needs of the industry.  We offer various polishing pad types depending on your final polishing requirements and characteristics.  We offer surface roughness, removal rat, and edge rounding options.

     

    PM-700 Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven
    PM-710 Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven
    HY NAP700 Nap/flock pad made with long viscose fibers
    HY NAP 730 Nap/flock pad made with long viscose fibers on the woven substrate
    HY NAP 780 Nap/flock pad made with thin, short viscose fibers on the woven substrate
    HY NAP 800 Nap/flock pad made with short viscose fibers on the woven substrate
    ATP 600 Thick non-woven made from polyester/polypropylene fibers with a buffed surface

     

    Pad Image

     

    Pad Applications:

    • Optical components: LiNbO3, CaF2, MgF2, Si, Ge, KTP, DKDP, etc.
    • Planarization of MEMS structures
    • Semiconductor materials: InP, Sapphire, GaSb, Si, SiC, GaN, etc.
    • Polishing of high-grade metal substrates: Titanium, Nickel, Copper, Gold, etc.
    • Industrial metals: Aluminum, Carbide, Steel, Bronze, etc.
    • Industrial Ceramics, Glass & Quartz
    Type Pad Name Thickness (mm) Hardness
    (Shore A)
    Surface Max Diameter (mm) Material Description Application
    Micro Cell PM700 1.5 72 Embossed or Perforated 1360 Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven Final polishing of metals and plastics
    PM710 1.2 74  
    Medium Nap HY NAP 700 1.1 86 N/A 980 Nap/flock pad made with long viscose fibers Final Polishing of metals and plastics
    HY NAP 730 1.12 85 1360 Nap/flock pad made with long viscose fivers on a woven substrate
    HY NAP 780 0.7 87 1440 Nap/flock pad made with thin and short viscose fibers on a woven substrate
    HY NAP 800 1 83 1440 Nap/flock pad made with short viscose fibers on a woven substrate
    Thick Non Woven ATP 600 3.8 60 Embossed or smooth 1440 Made from polyester/ polypropylene fibers, buffed surface Final polishing of glass with Hyprez cerium oxide slurries; good coverage of rounded edges

     

     

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    • Hyprez® Diamond & Colloidal Slurries and Dispensing Units
    • Hyprez® Diamond Compound
    • Fastlap Machines
    • Hyprez® Lapping Plates
    • Hyprez® Lap Plate Facing & Grooving
    • Hyprez® Polishing Pads
    • Helical Laps
    105 West Hintz Road, Wheeling, IL 60090
    Call: 847-808-9400
    Fax: +1-847-808-9430
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