The HVG Series Vertical Wafer Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components.
• Semiconductor wafer grinding or back-thinning of advanced materials such as:
• Substrates for semiconductor advanced packaging including MEMS (ceramic, polyimide)
The HVG Series machines are equipped with Engis grinding wheels based on the MAD Wheel (Mixed Abrasive Diamond) Technology, which tailors the wheel specification to the wafer being processed for optimum performance.
The HVG-AD and HVG-ADM models are equipped with controls that provide automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece, and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real-time is available. The ADM model offers automated thickness options: multi-point contact probing for multiple wafers grinding or a choice of contact or non-contact continuous in-process measurement for the single wafer.