High Precision Vertical Grinding Machines 

The HVG Series Grinding Machines

• Semiconductor wafer grinding or back-thinning of advanced materials  such as:  SiC GaAs Sapphire Si GaN AlN InP • Semiconductor equipment components (ceramic chucks, ULE glass) • Substrates for semiconductor advanced packaging including MEMS (ceramic, polyimide)

M.A.D. Technology 

The HVG Series machines are equipped with Engis grinding wheels based on the MAD (Mixed Abrasive Diamond) Wheel Technology, which tailors the wheel specification to the wafer being processed for optimum performance.

Mixed Abrasives Diamond Wheel	Abrasives Structure Image

Advanced Control Options 

The HVG-AD and HVG-ADM models are equipped with controls that provide automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece, and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real-time is available. The ADM model offers automated thickness options: multi-point contact probing for multiple wafers grinding or a choice of contact or non-contact continuous in-process measurement for the single wafer.

Engis is a global leader in the design and manufacture of complete grinding,  lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times, while minimizing manufacturing costs.  What really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none.  

Our systems are suitable for processing a vast range of materials - metals, ceramics, glass, semiconductor substrates, plastics and other advanced materials.  We have developed solutions for many industries improving quality, efficiency and cost.