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    High Precision Vertical Grinding Machines 

     

    Inquiries, Sales or Support 

     

    • EAG Single-Spindle Fully Automated Grinding Systems
    • EAG Dual Spindle, Fully-Automated Grinding System
    • High Precision Vertical Grinding Machines
    • Products
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    • HVG Grinder Series

    Diamond Struture
    SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE

    Man with microscopeADVANCED PROCESS DEVELOPMENT
    WEBBTELESCOPE 2
    VISIT OUR KNOLWEDGE CENTER
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    The HVG Series Grinding Machines

     The HVG Series Vertical Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components. 

    • Semiconductor wafer grinding or back-thinning of advanced materials  such as: 

    • SiC
    • GaAs
    • Sapphire
    • Si
    • GaN
    • AlN
    • InP
    • Semiconductor equipment components (ceramic chucks, ULE glass)

    • Substrates for semiconductor advanced packaging including MEMS (ceramic, polyimide)

    HVG- Small-1

     

    M.A.D. Technology 

    The HVG Series machines are equipped with Engis grinding wheels based on the MAD (Mixed Abrasive Diamond) Wheel Technology, which tailors the wheel specification to the wafer being processed for optimum performance.

    Mixed Abrasives Diamond Wheel

    Abrasives Structure Image

    MAD MAD2
    MAD3

    Advanced Control Options 

    The HVG-AD and HVG-ADM models are equipped with controls that provide automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece, and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real-time is available. The ADM model offers automated thickness options: multi-point contact probing for multiple wafers grinding or a choice of contact or non-contact continuous in-process measurement for the single wafer.


    Engis is a global leader in the design and manufacture of complete grinding,  lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times, while minimizing manufacturing costs.  What really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none.  

    Our systems are suitable for processing a vast range of materials - metals, ceramics, glass, semiconductor substrates, plastics and other advanced materials.  We have developed solutions for many industries improving quality, efficiency and cost.

     

    Contact Us-2

     

     


    Diamond Struture
    SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE

    Man with microscopeADVANCED PROCESS DEVELOPMENT
    WEBBTELESCOPE 2
    VISIT OUR KNOLWEDGE CENTER
    Tradeshow Schedule (1)
    LEARN MORE
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    ISO 9001 Certified Quality Management System - White

    • EAG Grinder - Single Spindle
    • EAG Grinder - Dual Spindle
    • HVG Grinder Series
    105 West Hintz Road, Wheeling, IL 60090
    Call: 847-808-9400
    Fax: +1-847-808-9430
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