https://www.engis.com/indium-phosphide-wafer-grinding
Si3N4
GA2O3
Ge
Si
Semiconductor Wafer Processing
The demands of today’s most advanced electronic devices drive the need to process new and challenging substrate materials. The subsurface damage-free surface requires consideration of the entire process and requires that each step is paired to the particular needs of the material. Engis can provide complete solutions for your advanced semiconductor wafer processing needs:
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Wafer Processing
Diamond
Si3N4
Silicon
Nitride
GA2O3
Gallium
Oxide
Ge
Germanium
Si
Silicon
Glass
What is your advanced material challenge?