--- title: Semiconductor - Advanced Materials description: Advanced Materials in the wafer process consists of three steps, grinding, lapping, polishing, and CMP. image: https://www.engis.com/hubfs/Sic%20Wafers%20.png --- [![Engis](https://www.engis.com/hs-fs/hubfs/Web%20Header.png?width=357&height=100&name=Web%20Header.png "Engis")](https://www.engis.com/homepage) ** [News](https://www.engis.com/press-and-news) [Articles](https://www.engis.com/knowledge-center)  [Careers](https://www.engis.com/careers) [Locations](https://www.engis.com/locations)   # Advanced Materials Wafer Process - Grinding, Lapping, Polishing & CMP   ![engis.com](https://www.engis.com/hubfs/Adv.%20materials%20.jpg) --- ![Diamond Struture](https://www.engis.com/hs-fs/hubfs/Diamond%20Struture.jpg?width=183&height=128&name=Diamond%20Struture.jpg)[**SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE**](https://www.engis.com/engis-micron-diamond-and-cbn-powders)[--- ](https://www.engis.com/engis-micron-and-cbn-diamond-powders) ![Man with microscope](https://www.engis.com/hs-fs/hubfs/cta1.jpg?width=155&height=133&name=cta1.jpg)[******ADVANCED PROCESS DEVELOPMENT****** --- ](https://www.engis.com/p)![WEBBTELESCOPE 2](https://www.engis.com/hs-fs/hubfs/WEBBTELESCOPE%202.png?width=163&height=137&name=WEBBTELESCOPE%202.png)**[VISIT OUR KNOLWEDGE CENTER](https://www.engis.com/knowledge-center)** --- ![Tradeshow Schedule (1)](https://www.engis.com/hs-fs/hubfs/Tradeshow%20Schedule%20(1).png?width=147&height=118&name=Tradeshow%20Schedule%20(1).png) [**LEARN MORE** --- ](https://www.engis.com/events)   ## Semiconductor Wafer Processing The demands of today’s most advanced electronic devices drive the need to process new and challenging substrate materials. The subsurface damage-free surface requires consideration of the entire process and requires that each step is paired to the particular needs of the material. Engis can provide complete solutions for your advanced semiconductor wafer processing needs:     ## Wafer Processing GRIND LAP POLISH & CMP [### SiC Silicon Carbide ](https://www.engis.com/sic-wafer-grinding) ### AL2O3 Sapphire ### GaN Gallium Nitride ### [InP Indium Phosphide](https://www.engis.com/indium-phosphide-wafer-grinding) ### AlN Aluminium Nitride ### GaAs Gallium Arsenide ### Diamond ### Si3N4 Silicon Nitride ### GA2O3 Gallium Oxide ### Ge Germanium ### Si Silicon ### Glass ### What is your advanced material challenge?   | ![WAFER LAPPING (3)](https://www.engis.com/hs-fs/hubfs/WAFER%20LAPPING%20(3).png?width=445&height=356&name=WAFER%20LAPPING%20(3).png) | ![WAFER GRINDING (1)](https://www.engis.com/hs-fs/hubfs/WAFER%20GRINDING%20(1).png?width=445&height=356&name=WAFER%20GRINDING%20(1).png) | | --- | --- |       [![Contact Us-2](https://www.engis.com/hs-fs/hubfs/Contact%20Us-2.jpg?width=222&height=46&name=Contact%20Us-2.jpg)](https://www.engis.com/contact)     [About Engis](https://www.engis.com/about-engis) [News & Press](https://www.engis.com/press-and-news) [Careers](https://www.engis.com/careers) [Locations](https://www.engis.com/locations) [Catalogs & Media](https://www.engis.com/catalogs-media) [Events](https://www.engis.com/events) [Contact Us](https://www.engis.com/contact) ![ISO 9001 Certified Quality Management System - White](https://www.engis.com/hs-fs/hubfs/ISO%209001%20Certified%20Quality%20Management%20System%20-%20White.png?width=109&height=43&name=ISO%209001%20Certified%20Quality%20Management%20System%20-%20White.png) 105 West Hintz Road, Wheeling, IL 60090 [Call: 847-808-9400](tel:+1-847-808-9400) Fax: +1-847-808-9430 ©2026 Engis Corporation. All Rights Reserved. Engis® is a registered trademark of Engis Corporation, USA and other countries. All products denoted with ® or ™ are registered trademarks or trademarks of Engis Corporation. [Privacy Statement](https://www.engis.com/privacy-statement) | [Terms of Use](https://www.engis.com/terms-of-use) | [Site Map](https://www.engis.com/site-map) | [Engis Terms & Conditions](https://www.engis.com/terms) [**](https://www.engis.com/semiconductor-advancedmaterials#)