Semiconductor Wafer Processing

The demands of today’s most advanced electronic devices drive the need to process new and challenging substrate materials. The subsurface damage-free surface requires consideration of the entire process and requires that each step is paired to the particular needs of the material. Engis can provide complete solutions for your advanced semiconductor wafer processing needs:

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Wafer Processing

SiC
Silicon
Carbide

AL2O3
Sapphire

GaN
Gallium
Nitride

InP
Indium
Phosphide

AlN
Aluminium
Nitride

GaAs
Gallium
Arsenide

Diamond

 

Si3N4
Silicon
Nitride

GA2O3
Gallium
Oxide

Ge
Germanium

Si
Silicon

Glass

What is your advanced material challenge?