Engis
    News Articles  Careers Locations  
    • About Engis
        • About Us
        • Advanced Process Development
        • Systems Approach
        • Engis History
        • President's Message
        • Associations & Affiliations
        • Quality Statement & ISO Certification
        • Engis Terms and Conditions
    • Industries
      • Engis at the Cutting Edge of Technology
        • Aerospace
        • Automotive
        • Foundry
        • Hydraulic
        • Lumber
        • Marine Engines
        • Medical
        • Powertrain
        • Precision Barrels
        • Precision Optics
    • Products
      • Engis Micron Diamond and CBN Powders
        • Diamond and CBN Powder Applications
      • Lapping & Polishing
        • Hyprez® Diamond & Colloidal Slurries and Dispensing Units
        • Hyprez® Diamond Compound
        • Fastlap Machines
        • Hyprez® Lap Plate Facing & Grooving
        • Hyprez® Lapping Plates
        • Hyprez® Polishing Pads
        • Helical Laps
      • Wafering Solutions
        • EAG Grinder - Single Spindle
        • EAG Grinder - Dual Spindle
        • HVG Grinder Series
      • Superabrasive Tools
        • Electroplated Superabrasive Grinding Wheels
        • Foundry Products
        • Electromill® Diamond Milling
        • Diamond CBN Saw Blades
        • Diamond CBN Pins & Mandrels
        • Electroplated Dressing Blocks, Files & Specialty Tools
        • Replate Service and Technical Support
      • Bore Honing Systems
        • Bore Finishing Process
        • Precision Bore Honing Machines
        • Automation and Gauging Packages
        • Dual Diameter Bore Finishing
        • Multi-Stroke Honing Systems
        • Contract Honing Services
        • Helical Laps
      • Mold & Die Polishing
        • Polishing Compounds
        • Diprofil Finishing Systems
        • Polishing Accessories
        • Sapphire Glass Polishing Kit
    • Service Support
    • Literature & Video
      • Catalogs and Brochures
        • Catalogs and Brochures
      • Fillable Online Forms
        • Fillable Online Forms
      • Videos
        • Videos
    • Events
    • Contact Us
      • Customer Service & Technical Support
        • Customer Service & Technical Support
      • Worldwide Locations
        • Worldwide Locations
      • Safety Data Sheets
        • Safety Data Sheets
      • Machine Service Request
        • Machine Service Request

    Mechanical Properties

     

    Inquiries, Sales or Support 


      Diamond Struture
      SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE

      Man with microscopeADVANCED PROCESS DEVELOPMENT
      WEBBTELESCOPE 2
      VISIT OUR KNOLWEDGE CENTER
      Tradeshow Schedule (1)
      LEARN MORE

      Mechanical Properties

      At Engis we measure the Mechanical Strength of both diamond or CBN crystals, which is the ability resist fracturing under static or dynamic (impact) loading. This is the most important property of the crystal and mirrors all other properties (size, shape and level of crystal growth defects). Crystal’s strength is critical to you when choosing a product as certain applications, such as working with stones and construction materials, which will require a diamond that will stay strong, not fracturing and ultimately losing its sharpness.

      Technique and Equipment

      • Mechanical Properties - Crushed vs UncrushedMechanical strength of diamond/CBN crystals is measured through crushing a sample consisting of a large number of crystals sharing similar size, shape and level of crystal growth defects under controlled loading and shear
      • Our in-house developed technique uses a combination of compressive and shear forces to crush micron sized diamond powder
      • Particle Size Distribution (PSD) is measured before and after crushing
      • The Crushing Strength Index is calculated based on that portion of PSD which remains true to size after crushing

      We also analyze Micro-Fracturing Characteristics which is the ability of diamond/CBN particles to fracture under severe mechanical stresses and develop new fresh cutting edges and points (a so-called self-sharpening mechanism).

      Mechanical Properties

       

      Technique and Equipment

      Particle Size AnalyzersWe utilize the appropriate particle size analyzers and analysis techniques to analyze the “crushed” diamond/CBN powders in micron and submicron size range, from which the differences in the amount and size of “fine chips” generated during crushing can be revealed.

      The fine particle analysis shows that the RA and MA powders exhibit different micro-fracturing characteristics with RA diamond powder generating more fine particles less than 1 micron when compared to the MA4 diamond powders.

      Micron Particle Sizing & Sub-Micron Fine Particle Analysis

      Micron Particle Sizing  Sub-Micron Fine Particle Analysis

       

      About Engis News & Press Careers Locations Catalogs & Media Events Contact Us

      ISO 9001 Certified Quality Management System - White

        105 West Hintz Road, Wheeling, IL 60090
        Call: 847-808-9400
        Fax: +1-847-808-9430
        ©2025 Engis Corporation. All Rights Reserved. Engis® is a registered trademark of Engis Corporation, USA and other countries.
        All products denoted with ® or ™ are registered trademarks or trademarks of Engis Corporation.
        Privacy Statement | Terms of Use | Site Map | Engis Terms & Conditions