Engis's Hyprez® EAG Model

Fully Automated Grinding System

 

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Engis's Hyprez® EAG Model
Our state-of-the-art offering, with fully automatic enhanced multi-spindle grinding system (Engis's Hyprez® EAG Model),
provides a low capital and operating expenditure solution for high precision wafering, giving an economic benefit to customers.
The machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control.
The aim is to produce ultra-flat wafers in a fully automatic cassette-to-cassette operation for grinding SiC wafers on both sides
and to develop tailored 'Grind-to-CMP Processes' for all wafers sliced by any wafering techniques.
 

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UPCOMING EVENTS

     EAG-28SAND                   EAG-28DANX            

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  Fully automatic dual spindle grinder  
 Rough and fine grinding with two spindles  
 In-process non contact thickness measurement or contact gauge  
 Stiff cast frame structure  
 PC-based machine  
SECS/GEM interface protocol  
 Real-time data monitoring  

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Download Spec Sheet Now!

 

ENGIS'S HYPREZ® EAG MODEL OVERVIEW


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PROCESS OVERVIEW


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PROCESS AUTOMATION

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OPERATION SCREEN


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