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    EAG Dual Spindle, Fully-Automated Grinding System

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    • EAG Single-Spindle Fully Automated Grinding Systems
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    • EAG Grinder - Dual Spindle

    Diamond Struture
    SURFACE ENGINEERING THROUGH DIAMOND EXPERTISE

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    Our Engis® Hyprez® EAG Model multi-spindle grinding system provides a cost-effective, high-precision wafering solution. This fully automated system grinds both sides of silicon carbide wafers using non-contact, in-situ measurement techniques to achieve targeted thickness control and ultra-flatness, often reducing or eliminating the need for lapping.

    Through a fully automatic cassette-to-cassette operation, the system aims to streamline wafer production and enable the development of tailored "Grind-to-CMP processes" for wafers produced by any slicing method. 

     

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    •  Fully automatic dual spindle grinder  •
    •  Rough and fine grinding with two spindles  •
    •  In-process non contact thickness measurement or contact gauge  •
    •  Stiff cast frame structure  •
    •  PC-based machine  •
    • SECS/GEM interface protocol  •
    •  Real-time data monitoring  •

    EAG MODEL OVERVIEW

    EAG Dual

     



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    AUTOMATION  OVERVIEW



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    • EAG Grinder - Single Spindle
    • EAG Grinder - Dual Spindle
    • HVG Grinder Series
    105 West Hintz Road, Wheeling, IL 60090
    Call: 847-808-9400
    Fax: +1-847-808-9430
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