Engis Hyprez®
Fully Automated 
Grinding Systems

Model EAG

 

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 EAG Grinding Systems
Our state-of-the-art offering, with fully automatic enhanced multi-spindle grinding system (Engis's Hyprez® EAG Model), provides a low capital and operating expenditure solution for high precision wafering, giving an economic benefit to customers.  The machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control.  The aim is to produce ultra-flat wafers in a fully automatic cassette-to-cassette operation for grinding SiC wafers on both sides and to develop tailored 'Grind-to-CMP Processes' for all wafers sliced by any wafering techniques.
 

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UPCOMING EVENTS

     EAG-28SAND                   EAG-28DANX            

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  Fully automatic single spindle grinder  

 In-process non-contact thickness measurement  

 Stiff cast frame structure  

 PC-based machine  

 Automatic dressing system  

 SECS/GEM interface protocol  

•  Real-time data monitoring  


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Download Spec Sheet Now!

 

ENGIS'S HYPREZ® EAG MODEL OVERVIEW


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PROCESS OVERVIEW


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PROCESS AUTOMATION

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OPERATION SCREEN


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