News & Press
Careers
Locations
About Engis
About Us
Associations & Affiliations
Core Values
Engis History
Quality Statement & ISO Certification
President's Message
Systems Approach
Engis Terms and Conditions
Industries
Choose Your Industry
Aerospace
Automotive
Foundry
Hydraulic
Lumber
Marine Engines
Medical
Powertrain
Precision Barrels
Precision Optics
Products
Engis Micron Diamond and CBN Powders
Diamond and CBN Powder Applications
Lapping & Polishing
Hyprez® Diamond & Colloidal Slurries
Hyprez® Diamond Compound
Fastlap Machines
Hyprez® Lap Plate Facing & Grooving
Hyprez® Lapping Plates
Hyprez® Polishing Pads
Helical ID & OD Lapping Tools
Wafering Solutions
EAG Grinder - Single Spindle
EAG Grinder - Dual Spindle
HVG Grinder Series
Superabrasive Tools
Electroplated Superabrasive Grinding Wheels
Foundry Products
Electromill® Diamond Milling
Diamond CBN Saw Blades
Diamond CBN Pins & Mandrels
Electroplated Dressing Blocks, Files & Specialty Tools
Replate Service and Technical Support
Bore Honing Systems
Bore Finishing Process
Dual Bore Diamond Tools
Single-Pass & Multi-stroke Bore Finishing
Precision Bore Honing Machines
Automation and Gauging Packages
Multi-Stroke Honing Systems
Contract Honing Services
Helical Laps
Mold & Die Polishing
Polishing Compounds
Diprofil Finishing Systems
Polishing Accessories
Catalogs & Media
Catalogs and Brochures
Videos
Press Releases
Events
Contact Us
Customer Service & Technical Support
Safety Data Sheets
Locations
Knowledge Center
Dynamic Particle Shape Analysis
Advanced Process Development
LEARN MORE
LEARN MORE
Engis® Micron Diamond and CBN Powders
Dynamic Particle Shape Analysis
Scanning Electron Microscopy (SEM) provides qualitative data about diamond type, size and surface
Optical microscope based image analysis equipment
Both size and shape parameters measured
.png?width=147&height=118&name=Tradeshow%20Schedule%20(1).png)
