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HYPREZ® Lapping & Polishing Machines & Accessories


Engis is a global leader in the design and manufacture of complete lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times, while keeping your manufacturing costs at a minimum.  With 70+ years of experience in designing state-of-the-art lapping & polishing equipment, Engis engineers machines that elevate both precision and performance at a reduced cost per piece.

But the machine is just one part of the puzzle….what really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none. Engis engineers understand the processes of Fine Grinding, Lapping and Polishing and use this experience to develop processes with controlled variables so that the unpredictability and mystique are removed from the lapping process and the science of fine finishing is advanced.

Read the recent article in Production Machining for additional details on Engis Diamond Lapping & Lapping Plate Control.

Choosing the Correct Machine Plate Size

Machines
FastLap Tabletop and Floor Standing Lapping and Polishing Machines
The FastLap Series of lapping & polishing machines is engineered for demanding flat lapping and polishing processes giving you maximum efficiency and quality control.   NEW….learn about the innovative Lapping Plate Facing Device now available on the FastLap line of lapping machines.
AMX Fine Grinding, Lapping and Polishing Machines
Engis AMX line of fine grinding, lapping and polishing machines is specifically designed for processing of advanced materials. Compact, versatile and with full PLC process controls. Designed for demanding diamond applications.
Double-Sided Grinding and Lapping Machine
This double-sided system can be used on a variety of materials to achieve a high degree of accuracy in flatness, parallelism and surface finish using either free abrasive slurry or fixed abrasive media.
EHG Back-Grinding Machines for Advanced Material Wafers
These horizontal grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, gallium nitride and silicon carbide.

Accessories
MiniMiser Slurry Dispensing System
The MiniMiser® helps to save you money by delivering precisely controlled amounts of Hyprez diamond slurry and lubricants in the lapping process
Hyprez Slurry Autostirrer
The Hyprez Autostirrer keeps diamond completely dispersed during usage by stirring the slurry with a magnetic spin bar; it can be used on all commercially available lapping machines.
Hyprez Lapping Plates
Engis lapping plates are customized to deliver optimum performance in your lapping system. Our composite lap plates enhance stock removal while producing high quality surface finish and flatness in both large volume operations and smaller hand lapping and polishing applications.
Hyprez Conditioning Rings & Work Rings
Hyprez conditioning rings set a new standard of quality by giving the finest results in flatness, surface finish and scratch-free surfaces. Because these rings are inherently tough and corrosion/abrasive resistant, they provide high productivity and efficiency.
Hyprez Parts Carriers and Rubber Pads
Pads and Carriers increase productivity by attaining precision surface flatness and finish when lapping parts of varying thickness.
Hyprez Workholding Fixture
(aka Wafer Thinning Device or Workholding Jig)
Use with Engis flat lapping machines to achieve part parallelism and micron accurate in-process thickness measurement.
Hyprez Wafer Bonding System
Specially designed to fix wafers and thin workpieces to lapping carriers using wax based adhesives, pressure and heat.
Hyprez Lapping Plate Flatness Gauges
Precisely measure the flatness of lapping plates. These gauges are corrosion resistant and built to last in production environments.
Hyprez Optical Flats and Monochromatic Lights
Measure part flatness efficiently and economically.

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