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This double sided system can be used on a variety of materials to achieve a high degree of accuracy in flatness, parallelism and surface finish. Designed for use with Engis diamond plates, the Engis double sided system reduces your processing time, as well as overall cost.
This unique system is suitable for your double sided lapping applications using either free abrasive slurries or for your fine grinding processes with fixed abrasive media.
Applications for Fine Grinding, Lapping &
Polishing Include:
• Tungsten carbide
• MLCC
• Hard metal
• Ceramic Substrate
• Composites
• NTC Substrate
• Aluminum
• Ferrite
• Silicon Carbide
• Sapphire….and others
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• Optical Glasses
• Sinter metal
• Zirconium
• Engineered Plastics
• Bronze
• PZT Substrate
• Diamond Dicing Blade
• Quartz
• Crystal
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