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The Engis HYPREZ® Total Diamond Lapping and Polishing System
  • Lapping and Polishing
  • Engis Corporation
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    Engis HYPREZ® Advanced Materials Back-Grinding, Flat Lapping & Polishing Systems


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    The exacting demands of diamond lapping and polishing of Advanced Materials are best satisfied with flexible, robust equipment.

    The Engis AMX line offers maximum process control with rigid support systems for the plate drive and workholding systems, along with full programmability of process parameters and in-situ feedback.

    The EHG line of Engis Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers for lapping and polishing.
     
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    Engis Corporation
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         Engis Corporation   •   105 West Hintz Road   •   Wheeling, Illinois 60090   •   Call: +1-847-808-9400   •   Fax: +1-847-808-9430Engis CorporationEngis CorporationEngis Corporation
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