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The exacting demands of diamond lapping and polishing of Advanced Materials are best satisfied with flexible, robust equipment.
The Engis AMX line offers maximum process control with rigid support systems for the plate drive and workholding systems, along with full programmability of process parameters and in-situ feedback.
The EHG line of Engis Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers for lapping and polishing.
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Engis AMX line of fine grinding, lapping and polishing machines are specifically designed for processing of advanced materials.
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Compact
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Versatile with full PLC process control
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Designed for demanding diamond applications
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EHG line of horizontal grinding machines are ideal for diamond grinding of advanced materials:
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Rigid structure for years of trouble free operation
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The perfect tool to thin down parts prior to lapping & polishing
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Available with in-process thickness feedback
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