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Applications Products Expertise
LAPPING PRODUCTS(HYPREZ)
LAPPING & POLISHING ADVANCED MATERIALS(MICROTECH)
HONING SYSTEMS(BORE FINISHING)
DIAMOND PLATED PRODUCTS(ELECTROGRIP)
DIAMOND POWDERS
GRINDING &
POLISHING TOOLS(DIAMOLD)
Expertise

Product Characterization and Qualification:

Particle Size Distribution (PSD)
Engis employs a variety of measurement techniques and analyzers for the determination of particle size distribution of diamond and CBN powders:
  • Electrical Sensing Zone Analyzers:
    • Coulter Beckman Multisizer
    • Elzone
  • Dynamic Light Scattering Analyzer – Horiba LB 500
  • Centrifugal Particle Size Analyzer – Shimadzu SA CP4
  • Disk Centrifuge Analyzer – CPS DC2400
Particle Shape Analysis:
  • Optical Microscopy
  • SEM Microscopy
  • Image Analysis
Surface Area Analysis (surface area determination):
  • BET analyzer
Bulk Purity Analysis (nature & concentration of extrinsic contaminants in diamond & CBN powder):
  • X-Ray Diffraction – qualitative phase analysis
  • Inductively Coupled Plasma (ICP) Spectroscopy – quantitative elemental analysis
Chemical Composition Analysis (nature & concentration of intrinsic impurities in diamond & CBN particles):
  • Inductively Coupled Plasma (ICP) Spectroscopy – quantitative elemental analysis
Surface Cleanliness Analysis (ionic content):
  • Ion Chromatography (IC) Analysis – nature & level of anions and cations associated with the diamond surface
  • Electrical Conductivity Determination (ionic content)
Crushing Strength Determination:
  • Crushing Strength Test (crushing strength & fracture mode of diamond & CBN powder)
Thermal Stability Determination:
  • Thermal Crushing Strength Test (crushing strength decay of diamond & CBN powder with temperature)
Application Tests:

A suite of lapping and polishing tests developed by Engis.

Contact us or click here for more information.

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