Systems
Engis Corporation is the leader in the design and manufacture of exceedingly precise systems for the processing of Advanced Materials.
Model AM 15
The Engis Corporation AM-15 bench-top or modular cart-top machine is designed to accommodate a variety of surface preparation requirements. Specifically, it is capable of backthinning, lapping and/or polishing of:
Semiconductor (silicon, germanium, etc.) materials Compound Semiconductor (GaAs, GaN & InP) materials, Electro-Optics (LiNbo3, BBO, etc)
Ceramic, Silicon Carbide, Sapphire,. &Glass.
This system is excellent for R&D work at Universities, Research Centers and for prototype and small volume work in the commercial sector, especially when development is needed without conflicting with production capability. It is a fully functional, rigid, yet compact, bench-top machine with advanced features & standard 15” diameter platen.
AM-15 SPECIFICATIONS
- Graphic Logic Controller, for operator friendly programming and machine control
- Rigid Cast Aluminum Base
- Precision Cartridge Spindle
- Variable Speed Main Spindle with Soft Start and Stop
- Fully Programmable Pressure Head
- “Ramp-Up” and “Ramp Down” features to avoid damage of the final polished component
- Totally Enclosed Working Area Fully Interlocked
Model MPC (Maximum Process Control)
Engis has introduced the MPC precision surface preparation system for the finishing of Advanced Materials. This system is specifically designed for unique polishing, delayering and planarization applications where R&D, prototype and small volume processing is required. It is ideal for polishing Advanced Materials such as silicon carbide, sapphire, metal foils or the delayering planarization of SiO2 and metalized depositions. The MPC system has been designed with the kinematics and control to allow development of processes that have 6-Sigma capability for material removal, flatness and surface finish generation. The menu-driven microprocessor control allows any polishing, delayering or planarizattion process to be fully optimized. The oscillation system provides 3-axis motion for true CMP kinematics.
MPC SPECIFICATIONS
- Touch-screen operator interface which can be enhanced
- Operator interface mounted on a swivel-style pendant
- All drives are programmable and reversible
- Data acquisition system and program stringing
- Oscillation features are controlled from the main input screen
- Slurry dispensing system controls integrated
- Digital readouts for all drive and pressure functions
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