Engis Corporation - Lapping & Polishing Advanced Materials (Microtech)

Systems

Consumables

Materials

R&D

LAPPING PRODUCTS(HYPREZ)

LAPPING & POLISHING ADVANCED MATERIALS(MICROTECH)

HONING SYSTEMS(BORE FINISHING)

DIAMOND PLATED PRODUCTS(ELECTROGRIP)

DIAMOND POWDERS

GRINDING &
POLISHING TOOLS(DIAMOLD)

Materials

Diamond is particularly well suited for grinding, lapping, and polishing many Advanced Materials which are difficult to efficiently process with conventional abrasives.

Some of the materials which Engis has developed diamond processes for include:

• Silicon Carbide
  - 4H and 6H substrates up to 100mm
  - CVD SiC Mirrors
  - Pressed and Sintered Material

• Sapphire
  - C, A, and R-planes
  - Epitaxial Finishing for substrates
  - Back Finishing to <50 um

• GaN
  - Epitaxial Finishing

• AlTiC
  - Disk head lapping
  - Back Finishing

• Silicon
  - 100 and 110 Planes
  - Optics
  - Epitaxial Finishing
  - Back Finishing

• Silicon Germanium
  - Planarization
  - Epitaxial Finishing

• Gallium Arsenide (GaAs)
  - Back Finishing

• Indium Phosphide
  - Epitaxial Finishing
  - Back Finishing

• Germanium
  - Epitaxial Finishing
  - Back Finishing

• YAG
  - Lens Polishing

• Calcium Fluoride (CaF2)
  - Lens Polishing

• Magnesium Fluoride (MgF2)
  - Lens Polishing

• Potassium Titanate (lcTP) Phosphate
  - Wave Guide Crystal Polishing

• Zirconia
  - Thickness < 50 um
  - TTV < 3um

• Titanium (MEMS)
  - Epitaxial Finishing
  - Thickness <30 um
  - TTV <3 u

• Nickel (MEMS)
  - Planarization

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