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Systems Consumables Materials R&D
LAPPING PRODUCTS(HYPREZ)
LAPPING & POLISHING ADVANCED MATERIALS(MICROTECH)
HONING SYSTEMS(BORE FINISHING)
DIAMOND PLATED PRODUCTS(ELECTROGRIP)
DIAMOND POWDERS
GRINDING &
POLISHING TOOLS(DIAMOLD)
Consumables

Engis is a pioneer in the use of free abrasive diamond products and specifically formulated slurries to replace CMP in the processing of advanced materials.

Diamond is a significantly sharper and more durable abrasive than aluminas which leads to a more efficient process. Diamond is the most efficient media for chemically resistant and hard materials which can prove to be difficult to polish with CMP vehicles.

This increase in processing efficiency leads to reduced slurry consumption and waste disposal, the virtual elimination of expensive pads, and lower cycle times. These benefits translate into lower costs to the manufacturer.

The carrier Engis utilizes with its diamond particles will not set up on the wafer as colloids do, and does not require special cleaning steps after processing. The end result is a cleaner, more efficient process.

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