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Specifications: Specialty Machines
The Hyprez® EHG-180AV Horizontal Grinding Machine with vacuum chuck is designed for use with our specialty diamond wheel. This unique system is designed for surface grinding silicon carbide, as well as backside grinding Sapphire LED wafers to the highest levels of flatness and surface finish, economically, saving labor costs and time.
In addition to micronizing its diamond powders and formulating its slurries, Engis also manufactures specialized lapping/polishing machines for the data storage industry. These machines feature an on-board plate facing device that shapes and texturizes composite and natural metal lapping plates on two separate axes, without the use of conditioning rings. Used in “kiss,” or crown, lapping of bars/sliders, as well as other advanced operations, the machine shortens cycle times and provides more precise, custom processing options.
Engis Corp. also represents wire saws and slurry re-claimers manufactured by Yasunaga Corporation (based in Japan), a pioneer in the development of wire saw machines. Yasunaga’s wire saws are designed for high-speed & high-precision processing of crystal AT cutting, solar silicon and other materials utilizing thinner wire and wire reciprocation.
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