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Specifications: Microtech
Specifically designed for unique polishing, delayering and planarization applications where R&D, prototype and small volume processing is required, Engis Microtech systems are available in both AM-15 benchtop and MPC floor-standing models. Each MPC system provides the kinematics and control required to develop processes that have 6-Sigma capability for material removal, flatness and surface finish generation. The menu-driven microprocessor control allows any polishing, delayering or planarization process to be fully optimized. The oscillation system provides 3-axis motion for true CMP kinematics.
Features:
• Ideal for universities and research labs, as well as commercial enterprises with unique, application-specific requirements
• A range of standard processes, developed by Engis, can be applied
• Compatible with both Engis precision diamond CMP-D slurries, as well as conventional abrasives, plates and other consumables and accessories
• Touch screen interface, fully customizeable
• Operator interface mounted on swivel-style pendant
• All drives are programmable and reversible
• Data acquisition and program stringing
• Oscillation features are controlled from main input screen
• Integrated slurry dispensing system controls
• Digital readouts for all drive and pressure functions
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