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Lapping Systems Machine Specs Lapping Plates Accessories Slurries
LAPPING PRODUCTS(HYPREZ)
LAPPING & POLISHING ADVANCED MATERIALS(MICROTECH)
HONING SYSTEMS(BORE FINISHING)
DIAMOND PLATED PRODUCTS(ELECTROGRIP)
DIAMOND POWDERS
GRINDING &
POLISHING TOOLS(DIAMOLD)
Specifications: LM Series

Setting a standard for rugged reliability and optimal processing flexibility, the Hyprez LM line of lapping and polishing systems has been a mainstay, mission-critical superfinishing solution for a wide variety of industries and applications – from aerospace to automotive…data storage to photonics.

Hyprez LM machines are in service the world over. Designed and engineered to
optimize the inherent superior finishing qualities of precision diamond abrasives,
Hyprez LM machines are available in 15” benchtop configurations as well as floor standing models ranging in plate size from 24” to 42”. These machines are equipped with a heavy duty precision spindle to support the lapping plate allowing no chatter or vibration even during high load finishing operations.

Features on all models include the following:

Variable speed drives for optimum feed travel
rates – 0 – 120 RPMs.

• Robust drive system
• Digital Readout Cycle Timer (Fully adjustable, with digital readout and auto-reset)
• 3 Ring Arms (Roller Yoke Type)
• Dial Indicator Flatness Gauge (Model 15LM)

The Floor Standing Models also include:

• Pneumatic pressure capable of running at loads to 500 pounds on the smaller units to 1000 pounds on the larger systems. Or they can be run with hand weighs.
• Individual pneumatic controls for each work station
• Electronic controls – Part of a two-hand control system to toggle the pressure plate up and down
• Plate cooling system controls (optional)

The Hyprez LM series of flat lapping and polishing machines bring high performance and economic efficiencies to your operation. Capable of consistently and repeatedly generating surface finishes to 0.5 nm Ra and surface flatness to 1/20 wavelength, Hyprez systems are suitable for processing virtually all solid materials, including metals, ceramics, glass, semiconductor substrates and electro-optical materials. Engis offers the most comprehensive choice of machine models designed specifically for advanced materials.

Through the use of our Hyprez Composite plates and our Diamond slurries, material removal rates range from 0.0001”/hr on hard and tough ceramic materials to over 0.005”/hour on many metals, glass and softer ceramic materials. The right combination of composite plate and diamond slurry as recommended by our experienced staff can make all the difference in rapid material removal and superior surface finish and Flatness.
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