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  • Engis UK Launches Ultra-Small Double-Sided Lapper

    Launched in Germany recently, the Engis 432 is an ultra-small footprint, four-way double-sided lapping and polishing machine designed specifically for research applications and short production runs in precision optical and small component manufacture.

    This latest model is said to be very flexible in its application, and with Engis diamond processing products, it can be used to lap most precision optics and advanced material – including sapphire, GaN and SiC. The machine can be operated in unmanned mode, either ‘timed’ or ‘thickness-controlled’ if required while still maintaining its accuracy and repeatability. Despite its compact size, the 432 can handle components measuring up to 55mm in diameter by 18mm thick, making it capable of processing a wide range of precision components.

    Easy accessibility is provided by a manual lift-off top plate, which simplifies the removal of components while minimizing part breakage, contamination of the working zone and the subsequent need for cleaning down or pad replacement. Accessories available with this bench-top machine include cast iron lap plates, stainless-steel plates for pad polishing, composite metal diamond polishing plates, an abrasive lapping slurry pump and a diamond dispensing system.


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