Engis Brings New Mold Polishing Compound to US Market Engis Corporation announces the US launch of its Hyprez Five Star/US diamond compound, suitable for use in virtually all polishing applications and in particular designed to enable mold tool makers to produce the high luster finishes their customers demand. Hyprez Five Star/US is the result of Engis’ extensive investment in the research and development of advanced lapping and polishing solutions, and is the first diamond compound on the market to combine the excellent cutting characteristics of natural diamond with the durability of manufactured diamond, to create an all-purpose, precision blend providing faster cutting and longer service life. This unique formulation, which has been engineered to withstand severe lapping conditions without loss of cutting quality, provides increased surface coverage as well as improved impregnation of lapping tools and can be used with both oil- soluble and water-soluble lubricants to meet users’ specific requirements of material and surface finish A comprehensive range of Hyprez Diamond Compounds is available to meet all the variables involved in lapping and polishing applications. By using genuine Hyprez compounds, in conjunction with the appropriate lapping and polishing machines, tools, plates and accessories, customers can be assured of consistent, repeatable results of the highest quality. Engis’ wealth of technical know-how combined with the company’s ISO 9002 certified quality systems, have made Hyprez the most trusted name in diamond compounds throughout the world.

	© 2012 Engis CorporationPrivacy Statement    •    Terms of Use    •    Site Map
	Home  •  Company  •  Lapping & Polishing  •  Diamond Powder  •  Grinding Products  •  Bore Finishing  •  Mold & Die Products  •  Information  •  Contact Us