Engis Corporation
CALL +1-847-808-9400
Engis Corporation
  • Engis Corporation
  • Home
  • Company
  • Products
  • Information
  • Contact Us
  • Engis
Engis HYPREZ® Micron Diamond and CBN Powders
  • Lapping and Polishing
  • Engis Corporation
    Engis Corporation Engis Corporation

    Engis® Micron Diamond and CBN Powders –
    Dynamic Particle Shape Analysis


    Engis Corporation Engis Corporation
    Engis Corporation Engis Corporation
    Irrespective of whether they are bonded into a wheel or tool, mixed into a slurry or compound, or even as a dry powder, only three dimensional abrasive particles will provide you with good cutting action. Blocky or irregular-shaped particles with multiple sharp cutting edges and corners represent the ideal morphology for achieving faster and cleaner cutting action.

    Scanning Electron Microscopy Optical microscope based image analysis equipment
    Scanning Electron Microscopy (SEM) provides qualitative data about diamond type, size and surface
    Optical microscope based image analysis equipment

    Both size and shape parameters measured
    Dynamic Particle Size Dynamic Particle Shape


    Engis Corporation Engis Corporation
    © Engis CorporationEngis CorporationPrivacy Statement    •    Terms of Use    •    Site MapEngis CorporationISO 9001:2008 Registered
    Engis Corporation Engis Corporation
    Home   |   Company   |   Lapping & Polishing   |   Diamond Powder   |   Grinding Products   |   Bore Finishing   |   Mold & Die Products   |   Information   |   Contact Us
    Engis Corporation
    Engis Corporation   •   105 West Hintz Road   •   Wheeling, Illinois 60090   •   Call: +1-847-808-9400   •   Fax: +1-847-808-9430   •   info@engis.com
    Engis Corporation
    Engis Corporation
    Engis Corporation